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| Datasheet | LPC18S50FET256,551 |
| File Size | 6,904.5 KB |
| Total Pages | 152 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 5 part numbers |
| Associated Parts | LPC18S50FET256,551, LPC18S30FET256E, LPC18S10FBD144E, LPC18S50FET180E, LPC18S10FET100E |
| Description | IC MCU 32BIT ROMLESS 256LBGA, IC MCU 32BIT ROMLESS 256LBGA, IC MCU 32BIT ROMLESS 144LQFP, IC MCU 32BIT ROMLESS 180TFBGA, IC MCU 32BIT ROMLESS 100TFBGA |
LPC18S50FET256,551 - NXP
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Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O 164 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-LBGA (17x17) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 164 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-LBGA (17x17) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 83 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 136K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package 144-LQFP (20x20) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O 118 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 180-TFBGA Supplier Device Package 180-TFBGA (12x12) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Number of I/O 49 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 136K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 4x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-TFBGA Supplier Device Package 100-TFBGA (9x9) |