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| Datasheet | LPC2362FBD100,551 |
| File Size | 479.24 KB |
| Total Pages | 65 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 2 part numbers |
| Associated Parts | LPC2362FBD100,551, LPC2361FBD100,551 |
| Description | IC MCU 32BIT 128KB FLASH 100LQFP, IC MCU 32BIT 64KB FLASH 100LQFP |
LPC2362FBD100,551 - NXP
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Manufacturer NXP USA Inc. Series LPC2300 Core Processor ARM7® Core Size 16/32-Bit Speed 72MHz Connectivity CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 70 Program Memory Size 128KB (128K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 58K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V Data Converters A/D 6x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |
Manufacturer NXP USA Inc. Series LPC2300 Core Processor ARM7® Core Size 16/32-Bit Speed 72MHz Connectivity CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 70 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 34K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V Data Converters A/D 6x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |