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LPC2470FBD208 Datasheet

LPC2470FBD208,551 Cover
DatasheetLPC2470FBD208,551
File Size513.56 KB
Total Pages91
ManufacturerNXP
Website
Total PartsThis datasheet covers 2 part numbers
Associated Parts LPC2470FBD208,551, LPC2470FET208,551
Description IC MCU 16/32BIT ROMLESS 208LQFP, IC MCU 16/32BIT ROMLESS 208TFBGA

LPC2470FBD208,551 - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

LPC2400

Core Processor

ARM7®

Core Size

16/32-Bit

Speed

72MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG

Peripherals

Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT

Number of I/O

160

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

98K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

208-LQFP

Supplier Device Package

208-LQFP (28x28)

Manufacturer

NXP USA Inc.

Series

LPC2400

Core Processor

ARM7®

Core Size

16/32-Bit

Speed

72MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG

Peripherals

Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT

Number of I/O

160

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

98K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

208-TFBGA

Supplier Device Package

208-TFBGA (15x15)