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| Datasheet | LPC812M101JD20J |
| File Size | 883.02 KB |
| Total Pages | 78 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 9 part numbers |
| Associated Parts | LPC812M101JD20J, LPC812M101JDH20J, LPC812M101JDH16J, LPC812M101JD20FP, LPC812M101JDH16FP, LPC811M001JDH16FP, LPC812M101JTB16X, LPC811M001JDH16J, LPC812M101JDH20FP |
| Description | IC MCU 32BIT 16KB FLASH 20SO, IC MCU 32BIT 16KB FLASH 20TSSOP, IC MCU 32BIT 16KB FLASH 16TSSOP, IC MCU 32BIT 16KB FLASH 20SO, IC MCU 32BIT 16KB FLASH 16TSSOP |
LPC812M101JD20J - NXP
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Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SO |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 14 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 20-SOIC (0.295", 7.50mm Width) Supplier Device Package 20-SO |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 14 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 14 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 14 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-XFDFN Supplier Device Package 16-XSON (3.2x2.5) |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 14 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
Manufacturer NXP USA Inc. Series LPC81xM Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 30MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |