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| Datasheet | MC33PF8200DGES |
| File Size | 173.07 KB |
| Total Pages | 2 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 5 part numbers |
| Associated Parts | MC33PF8200DGES, MC33PF8200DAES, MC33PF8200CLES, MC33PF8100CFEP, MC33PF8100CGES |
| Description | IC POWER MANAGEMENT I.MX8QM, IC POWER MANAGEMENT I.MX8QM, IC POWER MANAGEMENT, IC POWER MANAGEMENT I.MX8QXP, IC POWER MANAGEMENT I.MX8QM |
MC33PF8200DGES - NXP
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Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |