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| Datasheet | MC908MR8MPE |
| File Size | 5,236.05 KB |
| Total Pages | 372 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 10 part numbers |
| Associated Parts | MC908MR8MPE, MC908MR8CPE, MC908MR8CDWE, MCHC908MR8VFAE, MCHC908MR8MFAE, MCHC908MR8CFAE, MC908MR8MDWE, MC68HC908MR8CFA, MC68HC908MR8CP, MC68HC908MR8CDW |
| Description | IC MCU 8BIT 8KB FLASH 28DIP, IC MCU 8BIT 8KB FLASH 28DIP, IC MCU 8BIT 8KB FLASH 28SOIC, IC MCU 8BIT 8KB FLASH 32LQFP, IC MCU 8BIT 8KB FLASH 32LQFP |
MC908MR8MPE - NXP
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Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 12 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 12 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 12 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-SOIC (0.295", 7.50mm Width) Supplier Device Package 28-SOIC |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 16 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x10b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-LQFP Supplier Device Package 32-LQFP (7x7) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 16 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 32-LQFP Supplier Device Package 32-LQFP (7x7) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 16 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 32-LQFP Supplier Device Package 32-LQFP (7x7) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 12 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 28-SOIC (0.295", 7.50mm Width) Supplier Device Package 28-SOIC |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 16 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 7x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 32-LQFP Supplier Device Package 32-LQFP (7x7) |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 12 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 28-DIP (0.600", 15.24mm) Supplier Device Package 28-PDIP |
Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI Peripherals LVD, POR, PWM Number of I/O 12 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-SOIC (0.295", 7.50mm Width) Supplier Device Package 28-SOIC |