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MC912D60AMPVE8 Datasheet

MC912D60AMPVE8 Cover
DatasheetMC912D60AMPVE8
File Size5,816.2 KB
Total Pages460
ManufacturerNXP
Website
Total PartsThis datasheet covers 9 part numbers
Associated Parts MC912D60AMPVE8, MC912D60ACPV8, MC912D60ACFU8, MC912D60AVFUE8, MC912D60AMFUE8, MC912D60AVPVE8, MC912D60CCPVE, MC912D60ACFUE8, MC912D60ACPVE8
Description IC MCU 16BIT 60KB FLASH 112LQFP, IC MCU 16BIT 60KB FLASH 112LQFP, IC MCU 16BIT 60KB FLASH 80QFP, IC MCU 16BIT 60KB FLASH 80QFP, IC MCU 16BIT 60KB FLASH 80QFP

MC912D60AMPVE8 - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

68

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

68

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

48

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

80-QFP

Supplier Device Package

80-QFP (14x14)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

48

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C

Mounting Type

Surface Mount

Package / Case

80-QFP

Supplier Device Package

80-QFP (14x14)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

48

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

80-QFP

Supplier Device Package

80-QFP (14x14)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

68

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

68

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

48

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

80-QFP

Supplier Device Package

80-QFP (14x14)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

68

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)