Datasheet | MC9S08QA2CPAE |
File Size | 3,116.3 KB |
Total Pages | 200 |
Manufacturer | NXP |
Website | |
Total Parts | This datasheet covers 3 part numbers |
Associated Parts | MC9S08QA2CPAE, MC9S08QA2CFQE, MC9S08QA2CDNE |
Description | IC MCU 8BIT 2KB FLASH 8DIP, IC MCU 8BIT 2KB FLASH 8DFN, IC MCU 8BIT 2KB FLASH 8SOIC |
MC9S08QA2CPAE - NXP
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MC9S08QA2CPAE | NXP | IC MCU 8BIT 2KB FLASH 8DIP | 347 More on Order |
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MC9S08QA2CFQE | NXP | IC MCU 8BIT 2KB FLASH 8DFN | 498 More on Order |
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MC9S08QA2CDNE | NXP | IC MCU 8BIT 2KB FLASH 8SOIC | 282 More on Order |
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NXP Manufacturer NXP USA Inc. Series S08 Core Processor S08 Core Size 8-Bit Speed 20MHz Connectivity - Peripherals LVD, POR, PWM, WDT Number of I/O 4 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 160 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 8-DIP (0.300", 7.62mm) Supplier Device Package 8-PDIP |
NXP Manufacturer NXP USA Inc. Series S08 Core Processor S08 Core Size 8-Bit Speed 20MHz Connectivity - Peripherals LVD, POR, PWM, WDT Number of I/O 4 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 160 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 8-VDFN Exposed Pad Supplier Device Package 8-DFN-EP (4x4) |
NXP Manufacturer NXP USA Inc. Series S08 Core Processor S08 Core Size 8-Bit Speed 20MHz Connectivity - Peripherals LVD, POR, PWM, WDT Number of I/O 4 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 160 x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters A/D 4x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 8-SOIC (0.154", 3.90mm Width) Supplier Device Package 8-SOIC |