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MC9S12DP512CPV Datasheet

MC9S12DP512CPV Cover
DatasheetMC9S12DP512CPV
File Size4,657.96 KB
Total Pages124
ManufacturerNXP
Website
Total PartsThis datasheet covers 6 part numbers
Associated Parts MC9S12DP512CPV, MC9S12DP512VPVE, MC9S12A512CPVE, MC9S12DP512CPVE, MC9S12DP512CPVER, MC9S12DP512MPVE
Description IC MCU 16BIT 512KB FLASH 112LQFP, IC MCU 16BIT 512KB FLASH 112LQFP, IC MCU 16BIT 512KB FLASH 112LQFP, IC MCU 16BIT 512KB FLASH 112LQFP, IC MCU 16BIT 512KB FLASH 112LQFP

MC9S12DP512CPV - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

HCS12

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, I²C, SCI, SPI

Peripherals

PWM, WDT

Number of I/O

91

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

12K x 8

Voltage - Supply (Vcc/Vdd)

2.35V ~ 5.25V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

HCS12

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, I²C, SCI, SPI

Peripherals

PWM, WDT

Number of I/O

91

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

12K x 8

Voltage - Supply (Vcc/Vdd)

2.35V ~ 5.25V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

HCS12

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, I²C, SCI, SPI

Peripherals

PWM, WDT

Number of I/O

91

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

14K x 8

Voltage - Supply (Vcc/Vdd)

2.35V ~ 5.25V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

HCS12

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, I²C, SCI, SPI

Peripherals

PWM, WDT

Number of I/O

91

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

12K x 8

Voltage - Supply (Vcc/Vdd)

2.35V ~ 5.25V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

HCS12

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, I²C, SCI, SPI

Peripherals

PWM, WDT

Number of I/O

91

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

12K x 8

Voltage - Supply (Vcc/Vdd)

2.35V ~ 5.25V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

HCS12

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, I²C, SCI, SPI

Peripherals

PWM, WDT

Number of I/O

91

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

12K x 8

Voltage - Supply (Vcc/Vdd)

2.35V ~ 5.25V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)