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MCIMX6L3EVN10AC Datasheet

MCIMX6L3EVN10AC Cover
DatasheetMCIMX6L3EVN10AC
File Size1,646.77 KB
Total Pages106
ManufacturerNXP
Website
Total PartsThis datasheet covers 10 part numbers
Associated Parts MCIMX6L3EVN10AC, MCIMX6L7DVN10AC, MCIMX6L8DVN10AC, MCIMX6L8DVN10ACR, MCIMX6L2EVN10ACR, MCIMX6L8DVN10ABR, MCIMX6L2EVN10ABR, MCIMX6L2EVN10AC, MCIMX6L3DVN10AC, MCIMX6L2DVN10AC
Description I.MX 6SL ROM PERF ENHAN, I.MX6 SL ROM ENHANCE, I.MX 6SL ROM PERF ENHAN, I.MX 6SL ROM PERF ENHAN, I.MX 6SL ROM PERF ENHAN

MCIMX6L3EVN10AC - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)

Manufacturer

NXP USA Inc.

Series

i.MX6SL

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 + PHY (3)

Voltage - I/O

1.2V, 1.8V, 3.0V

Operating Temperature

0°C ~ 95°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

432-TFBGA

Supplier Device Package

432-MAPBGA (13x13)