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| Datasheet | MCIMX6QP4AVT1AB |
| File Size | 3,181.02 KB |
| Total Pages | 166 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 15 part numbers |
| Associated Parts | MCIMX6QP4AVT1AB, MCIMX6QP6AVT8AB, MCIMX6QP6AVT1AAR, MCIMX6QP4AVT8AB, MCIMX6DP4AVT1ABR, MCIMX6DP4AVT1AAR, MCIMX6DP6AVT8ABR, MCIMX6DP4AVT8ABR, MCIMX6DP6AVT8AAR, MCIMX6DP4AVT8AAR, MCIMX6DP4AVT1AB, MCIMX6DP6AVT8AB, MCIMX6DP6AVT1AB, MCIMX6QP6AVT1AB, MCIMX6DP4AVT8AB |
| Description | I.MX 6QP ROM PERF ENHAN, I.MX 6QP ROM PERF ENHAN, I.MX 6 SERIES 32-BIT MPU QUAD A, I.MX 6QP ROM PERF ENHAN, IC MPU I.MX6DP ENHAN 624FCBGA |
MCIMX6QP4AVT1AB - NXP
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Manufacturer NXP USA Inc. Series i.MX6QP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 4 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6QP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 4 Core, 32-Bit Speed 852MHZ Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6QP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 4 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6QP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 4 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 852MHZ Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 852MHZ Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 852MHZ Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 852MHZ Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |
Manufacturer NXP USA Inc. Series i.MX6DP Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 2 Core, 32-Bit Speed 852MHZ Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, DDR3L, DDR3 Graphics Acceleration Yes Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet 10/100/1000Mbps (1) SATA SATA 3Gbps (1) USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature -40°C ~ 125°C (TJ) Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case 624-FBGA, FCBGA Supplier Device Package 624-FCBGA (21x21) |