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MCP11A1CFNE3 Datasheet

MCP11A1CFNE3 Cover
DatasheetMCP11A1CFNE3
File Size3,803.55 KB
Total Pages158
ManufacturerNXP
Website
Total PartsThis datasheet covers 7 part numbers
Associated Parts MCP11A1CFNE3, MC68HC11A1CFNE3R, MCP11A1CFNE3R, MC68HC11A1MFNE, MC68HC11A1CFNE3, MC68HC11A0CFNE3, MC68HC11A1MFNER
Description IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC

MCP11A1CFNE3 - NXP

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MC68HC11A1MFNE MC68HC11A1MFNE NXP IC MCU 8BIT ROMLESS 52PLCC 482

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URL Link

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)