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| Datasheet | MK28FN2M0VMI15 |
| File Size | 1,052.32 KB |
| Total Pages | 87 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 4 part numbers |
| Associated Parts | MK28FN2M0VMI15, MK28FN2M0AVMI15, MK28FN2M0CAU15R, MK28FN2M0ACAU15R |
| Description | IC MCU 32BIT 2MB FLASH 169MAPBGA, IC MCU 32BIT 2MB FLASH 169MAPBGA, IC MCU 32BIT 2MB FLASH 210WLCSP, IC MCU 32BIT 2MB FLASH 210WLCSP |
MK28FN2M0VMI15 - NXP
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Manufacturer NXP USA Inc. Series Kinetis K28F Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 150MHz Connectivity EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 120 Program Memory Size 2MB (2M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1M x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type Internal/External Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 169-LFBGA Supplier Device Package 169-MAPBGA (9x9) |
Manufacturer NXP USA Inc. Series Kinetis K27F Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 150MHz Connectivity EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 120 Program Memory Size 2MB (2M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1M x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type Internal/External Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 169-LFBGA Supplier Device Package 169-MAPBGA (9x9) |
Manufacturer NXP USA Inc. Series Kinetis K28F Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 150MHz Connectivity EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 120 Program Memory Size 2MB (2M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1M x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type Internal/External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 210-UFBGA, WLCSP Supplier Device Package 210-WLCSP (6.93x6.93) |
Manufacturer NXP USA Inc. Series Kinetis K27F Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 150MHz Connectivity EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 120 Program Memory Size 2MB (2M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 1M x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type Internal/External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 210-UFBGA, WLCSP Supplier Device Package 210-WLCSP (6.93x6.93) |