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MK60DN512ZAB10R Datasheet

MK60DN512ZAB10R Cover
DatasheetMK60DN512ZAB10R
File Size2,195.12 KB
Total Pages72
ManufacturerNXP
Website
Total PartsThis datasheet covers 2 part numbers
Associated Parts MK60DN512ZAB10R, MK60DN512ZCAB10R
Description IC MCU 32BIT 512KB FLASH 120CSP, IC MCU 32BIT 512KB FLASH 120CSP

MK60DN512ZAB10R - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

Kinetis K60

Core Processor

ARM® Cortex®-M4

Core Size

32-Bit

Speed

100MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Peripherals

DMA, I²S, LVD, POR, PWM, WDT

Number of I/O

-

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Data Converters

A/D 38x16b; D/A 2x12b

Oscillator Type

Internal

Operating Temperature

0°C ~ 70°C (TA)

Mounting Type

Surface Mount

Package / Case

120-UFBGA, WLCSP

Supplier Device Package

120-WLCSP (5.29x5.28)

Manufacturer

NXP USA Inc.

Series

Kinetis K60

Core Processor

ARM® Cortex®-M4

Core Size

32-Bit

Speed

100MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Peripherals

DMA, I²S, LVD, POR, PWM, WDT

Number of I/O

-

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Data Converters

A/D 38x16b; D/A 2x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

120-UFBGA, WLCSP

Supplier Device Package

120-WLCSP (5.29x5.28)