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MK65FN2M0CAC18R Datasheet

MK65FN2M0CAC18R Cover
DatasheetMK65FN2M0CAC18R
File Size1,530.82 KB
Total Pages88
ManufacturerNXP
Website
Total PartsThis datasheet covers 2 part numbers
Associated Parts MK65FN2M0CAC18R, MK65FX1M0CAC18R
Description IC MCU 32BIT 2MB FLASH 169WLCSP, IC MCU 32BIT 1MB FLASH 169WLCSP

MK65FN2M0CAC18R - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

Kinetis K60

Core Processor

ARM® Cortex®-M4

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Peripherals

DMA, I²S, LVD, POR, PWM, WDT

Number of I/O

116

Program Memory Size

2MB (2M x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256K x 8

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Data Converters

A/D 2x16b; D/A 2x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

169-UFBGA, WLCSP

Supplier Device Package

169-WLCSP (5.5x5.63)

Manufacturer

NXP USA Inc.

Series

Kinetis K60

Core Processor

ARM® Cortex®-M4

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Peripherals

DMA, I²S, LVD, POR, PWM, WDT

Number of I/O

116

Program Memory Size

1MB (1M x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

256K x 8

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Data Converters

A/D 2x16b; D/A 2x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

169-UFBGA, WLCSP

Supplier Device Package

169-WLCSP (5.5x5.63)