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| Datasheet | NX3DV3899HR,115 |
| File Size | 197.49 KB |
| Total Pages | 22 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 2 part numbers |
| Associated Parts | NX3DV3899HR,115, NX3DV3899GU,115 |
| Description | IC ANLG SWITCH DPDT 16-HXQFN, IC ANLG SWITCH DPDT 16XQFN |
NX3DV3899HR,115 - NXP
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Manufacturer NXP USA Inc. Series - Switch Circuit DPDT Multiplexer/Demultiplexer Circuit 2:2 Number of Circuits 2 On-State Resistance (Max) 3.3Ohm Channel-to-Channel Matching (ΔRon) 700mOhm Voltage - Supply, Single (V+) 1.4V ~ 4.3V Voltage - Supply, Dual (V±) - Switch Time (Ton, Toff) (Max) 40ns, 20ns -3db Bandwidth 200MHz Charge Injection 4pC Channel Capacitance (CS(off), CD(off)) 8pF Current - Leakage (IS(off)) (Max) 5nA Crosstalk -90dB @ 1MHz Operating Temperature -40°C ~ 125°C (TA) Package / Case 16-XFQFN Exposed Pad Supplier Device Package 16-HXQFN (3x3) |
Manufacturer NXP USA Inc. Series - Switch Circuit DPDT Multiplexer/Demultiplexer Circuit 2:2 Number of Circuits 2 On-State Resistance (Max) 3.3Ohm Channel-to-Channel Matching (ΔRon) 700mOhm Voltage - Supply, Single (V+) 1.4V ~ 4.3V Voltage - Supply, Dual (V±) - Switch Time (Ton, Toff) (Max) 40ns, 20ns -3db Bandwidth 200MHz Charge Injection 4pC Channel Capacitance (CS(off), CD(off)) 8pF Current - Leakage (IS(off)) (Max) 5nA Crosstalk -90dB @ 1MHz Operating Temperature -40°C ~ 125°C (TA) Package / Case 16-XFQFN Supplier Device Package 16-XQFN (1.8x2.6) |