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R7F7010173AFP#KA2 Datasheet

R7F7010173AFP#KA2 Cover
DatasheetR7F7010173AFP#KA2
File Size236.78 KB
Total Pages2
ManufacturerRenesas Electronics America
Website
Total PartsThis datasheet covers 2 part numbers
Associated Parts R7F7010173AFP#KA2, R7F7010173AFP#KA4
Description IC MCU 32BIT SMD, IC MCU 32BIT 144-LQFP

R7F7010173AFP#KA2 - Renesas Electronics America

R7F7010173AFP#KA2 Datasheet Page 1
R7F7010173AFP#KA2 Datasheet Page 2

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URL Link

R7F7010173AFP#KA2

Renesas Electronics America

Manufacturer

Renesas Electronics America

Series

RH850/F1x

Core Processor

RH850G3K

Core Size

32-Bit

Speed

80MHz

Connectivity

CANbus, CSI, I²C, LINbus, SPI, UART/USART

Peripherals

DMA, PWM, WDT

Number of I/O

65

Program Memory Size

384KB (384K x 8)

Program Memory Type

FLASH

EEPROM Size

32K x 8

RAM Size

48K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 14x10b, 11x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

80-LQFP

Supplier Device Package

80-LFQFP (12x12)

R7F7010173AFP#KA4

Renesas Electronics America

Manufacturer

Renesas Electronics America

Series

RH850/F1x

Core Processor

RH850G3K

Core Size

32-Bit

Speed

80MHz

Connectivity

CANbus, CSI, I²C, LINbus, SPI, UART/USART

Peripherals

DMA, PWM, WDT

Number of I/O

65

Program Memory Size

384KB (384K x 8)

Program Memory Type

FLASH

EEPROM Size

32K x 8

RAM Size

48K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 14x10b, 11x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

80-LQFP

Supplier Device Package

80-LFQFP (12x12)