Semiconductors
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Optoelectronics
| Datasheet | S1C17W22F00B100 |
| File Size | 719.53 KB |
| Total Pages | 13 |
| Manufacturer | Epson Electronics |
| Website | |
| Total Parts | This datasheet covers 7 part numbers |
| Associated Parts | S1C17W22F00B100, S1C17W22D00B000, S1C17W23F101100-90, S1C17W22F101100-90, S1C17W22D101100, S1C17W23F101100, S1C17W22F101100 |
| Description | IC MCU 16BIT 64KB FLASH 128TQFP, IC MCU 16BIT 64KB FLASH DIE, 16-BIT MCU 4.2MHZ 96KB FLASH 8KB, 16-BIT MCU 4.2MHZ 64KB FLASH 4KB, IC MCU 16BIT 64KB FLASH DIE |
S1C17W22F00B100 - Epson Electronics
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Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, RFC, WDT Number of I/O 41 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 128-TQFP Supplier Device Package - |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, RFC, WDT Number of I/O 41 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case Die Supplier Device Package Die |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series * Core Processor - Core Size - Speed - Connectivity - Peripherals - Number of I/O - Program Memory Size - Program Memory Type - EEPROM Size - RAM Size - Voltage - Supply (Vcc/Vdd) - Data Converters - Oscillator Type - Operating Temperature - Mounting Type - Package / Case - Supplier Device Package - |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series * Core Processor - Core Size - Speed - Connectivity - Peripherals - Number of I/O - Program Memory Size - Program Memory Type - EEPROM Size - RAM Size - Voltage - Supply (Vcc/Vdd) - Data Converters - Oscillator Type - Operating Temperature - Mounting Type - Package / Case - Supplier Device Package - |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, RFC, WDT Number of I/O 41 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case Die Supplier Device Package Die |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, RFC, WDT Number of I/O 41 Program Memory Size 96KB (96K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 128-TQFP Supplier Device Package 128-TQFP (14x14) |
Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 4.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, RFC, WDT Number of I/O 41 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 128-TQFP Supplier Device Package 128-TQFP (14x14) |