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| Datasheet | SPC5777CDK3MMO4R |
| File Size | 1,082.07 KB |
| Total Pages | 90 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 27 part numbers |
| Associated Parts | SPC5777CDK3MMO4R, SPC5777CDK3MME4R, SPC5777CSK3MMO3, SPC5777CLK3MMO3, SPC5777CCK3MMO3, SPC5777CAK3MMO3, SPC5777CRK3MMO3, SPC5777CSK3MME3, SPC5777CLK3MME3, SPC5777CSK3MMO3R, SPC5777CRK3MME3, SPC5777CAK3MME3, SPC5777CLK3MMO3R, SPC5777CDK3MMO3R, SPC5777CCK3MMO3R, SPC5777CK3MMO3R, SPC5777CAK3MMO3R, SPC5777CSK3MME3R, SPC5777CDK3MME3R, SPC5777CCK3MME3R, SPC5777CK3MME3R, SPC5777CAK3MME3R, SPC5777CDK3MMO3, SPC5777CDK3MME3, SPC5777CDK3MME4, SPC5777CDK3MMO4, SPC5777CCK3MME3 |
| Description | IC MCU 32BIT 8MB FLASH 516MAPBGA, IC MCU 32BIT 8MB FLASH 416MAPBGA, IC MCU 32BIT 8MB FLASH 516MAPBGA, IC MCU 32BIT 8MB FLASH 516MAPBGA, IC MCU 32BIT 8MB FLASH 516MAPBGA |
SPC5777CDK3MMO4R - NXP
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Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 516-BGA Supplier Device Package 516-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Tri-Core Speed 264MHz Connectivity EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O - Program Memory Size 8MB (8M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 16b Sigma-Delta, eQADC Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |