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| Datasheet | W978H6KBQX2I |
| File Size | 4,121.3 KB |
| Total Pages | 122 |
| Manufacturer | Winbond Electronics |
| Website | |
| Total Parts | This datasheet covers 8 part numbers |
| Associated Parts | W978H6KBQX2I, W978H6KBQX2E, W978H2KBQX2I, W978H2KBQX2E, W978H2KBVX2I, W978H2KBVX2E, W978H6KBVX2I, W978H6KBVX2E |
| Description | IC DRAM 256M PARALLEL 168WFBGA, IC DRAM 256M PARALLEL 168WFBGA, IC DRAM 256M PARALLEL 168WFBGA, IC DRAM 256M PARALLEL 168WFBGA, IC DRAM 256M PARALLEL 134VFBGA |
W978H6KBQX2I - Winbond Electronics
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Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (16M x 16) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 168-WFBGA Supplier Device Package 168-WFBGA (12x12) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (16M x 16) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -25°C ~ 85°C (TC) Mounting Type Surface Mount Package / Case 168-WFBGA Supplier Device Package 168-WFBGA (12x12) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (8M x 32) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 168-WFBGA Supplier Device Package 168-WFBGA (12x12) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (8M x 32) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -25°C ~ 85°C (TC) Mounting Type Surface Mount Package / Case 168-WFBGA Supplier Device Package 168-WFBGA (12x12) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (8M x 32) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 134-VFBGA Supplier Device Package 134-VFBGA (10x11.5) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (8M x 32) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -25°C ~ 85°C (TC) Mounting Type Surface Mount Package / Case 134-VFBGA Supplier Device Package 134-VFBGA (10x11.5) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (16M x 16) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 134-VFBGA Supplier Device Package 134-VFBGA (10x11.5) |
Manufacturer Winbond Electronics Series - Memory Type Volatile Memory Format DRAM Technology SDRAM - Mobile LPDDR2 Memory Size 256Mb (16M x 16) Memory Interface Parallel Clock Frequency 400MHz Write Cycle Time - Word, Page 15ns Access Time - Voltage - Supply 1.14V ~ 1.95V Operating Temperature -25°C ~ 85°C (TC) Mounting Type Surface Mount Package / Case 134-VFBGA Supplier Device Package 134-VFBGA (10x11.5) |