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XC226796F66LACKXUMA1 Datasheet

XC226796F66LACKXUMA1 Cover
DatasheetXC226796F66LACKXUMA1
File Size1,516.48 KB
Total Pages116
ManufacturerInfineon Technologies
Websitehttps://www.infineon.com
Total PartsThis datasheet covers 4 part numbers
Associated Parts XC226796F66LACKXUMA1, XC226796F80LACKXUMA1, XC226756F66LACKXUMA1, XC226456F66LACKXUMA1
Description IC MCU 32BIT 768KB FLASH 100LQFP, IC MCU 32BIT 768KB FLASH 100LQFP, IC MCU 32BIT 448KB FLASH 100LQFP, IC MCU 32BIT 448KB FLASH 100LQFP

XC226796F66LACKXUMA1 - Infineon Technologies

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URL Link

XC226796F66LACKXUMA1

Infineon Technologies

Manufacturer

Infineon Technologies

Series

XC22xx

Core Processor

C166SV2

Core Size

16/32-Bit

Speed

66MHz

Connectivity

CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI

Peripherals

DMA, I²S, POR, PWM, WDT

Number of I/O

75

Program Memory Size

768KB (768K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

82K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

100-LQFP Exposed Pad

Supplier Device Package

PG-LQFP-100-3

XC226796F80LACKXUMA1

Infineon Technologies

Manufacturer

Infineon Technologies

Series

XC22xx

Core Processor

C166SV2

Core Size

16/32-Bit

Speed

80MHz

Connectivity

CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI

Peripherals

DMA, I²S, POR, PWM, WDT

Number of I/O

75

Program Memory Size

768KB (768K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

82K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

100-LQFP Exposed Pad

Supplier Device Package

PG-LQFP-100-3

XC226756F66LACKXUMA1

Infineon Technologies

Manufacturer

Infineon Technologies

Series

XC22xx

Core Processor

C166SV2

Core Size

16/32-Bit

Speed

66MHz

Connectivity

CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI

Peripherals

DMA, I²S, POR, PWM, WDT

Number of I/O

75

Program Memory Size

448KB (448K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

34K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

100-LQFP Exposed Pad

Supplier Device Package

PG-LQFP-100-3

XC226456F66LACKXUMA1

Infineon Technologies

Manufacturer

Infineon Technologies

Series

XC22xx

Core Processor

C166SV2

Core Size

16/32-Bit

Speed

66MHz

Connectivity

CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI

Peripherals

DMA, I²S, POR, PWM, WDT

Number of I/O

75

Program Memory Size

448KB (448K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

34K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 8x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

100-LQFP Exposed Pad

Supplier Device Package

PG-LQFP-100-3