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XC7Z100-2FF900I Datasheet

XC7Z100-2FF900I Cover
DatasheetXC7Z100-2FF900I
File Size3,796.81 KB
Total Pages86
ManufacturerXilinx
Website
Total PartsThis datasheet covers 3 part numbers
Associated Parts XC7Z100-2FF900I, XC7Z045-2FF900I, XC7Z030-1FF676I
Description IC SOC CORTEX-A9 800MHZ 900FCBGA, IC SOC CORTEX-A9 800MHZ 900FCBGA, IC SOC CORTEX-A9 667MHZ 676FCBGA

XC7Z100-2FF900I - Xilinx

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XC7Z045-2FF900I XC7Z045-2FF900I Xilinx IC SOC CORTEX-A9 800MHZ 900FCBGA 460

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XC7Z030-1FF676I XC7Z030-1FF676I Xilinx IC SOC CORTEX-A9 667MHZ 676FCBGA 537

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URL Link

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

Kintex™-7 FPGA, 444K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

Kintex™-7 FPGA, 350K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

667MHz

Primary Attributes

Kintex™-7 FPGA, 125K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27x27)