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W987D2HBJX6I


Part Number W987D2HBJX6I
Zouser Part # W987D2HBJX6I
Manufacturer Winbond Electronics
Category SemiconductorsMemory ICsMemory
Description IC DRAM 128M PARALLEL 90VFBGA
Lifecycle Not For New Designs
RoHS No RoHS Information
EDA/CAD Models W987D2HBJX6I PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Nov 28 - Dec 3 (Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*

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ISO9001 ISO14001 RoHS Compliant IAF CNAS UKAS

Quick Inquiry

In Stock380 - More on Order
Quote LimitNo Limit
Lead-TimeTo be Confirmed
Minimum1

Pricing (USD)

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W987D2HBJX6I Specifications

Part Number W987D2HBJX6I
Brand Winbond Electronics
Lifecycle Not For New Designs
RoHS No RoHS Information
Product Line Semiconductors
Category Memory ICs
Subcategory Memory
Manufacturer Winbond Electronics
Series -
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPSDR
Memory Size 128Mb (4M x 32)
Memory Interface Parallel
Clock Frequency 166MHz
Write Cycle Time - Word, Page 15ns
Access Time 5.4ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 90-TFBGA
Supplier Device Package 90-VFBGA (8x13)

W987D2HBJX6I Documents

W987D2HBJX6I, W987D2HBJX6I Datasheet (Total Pages: 68, Size: 1,470.3 KB)
W987D2HBJX7E Datasheet CoverW987D2HBJX7E Datasheet Page 2W987D2HBJX7E Datasheet Page 3W987D2HBJX7E Datasheet Page 4W987D2HBJX7E Datasheet Page 5W987D2HBJX7E Datasheet Page 6W987D2HBJX7E Datasheet Page 7W987D2HBJX7E Datasheet Page 8W987D2HBJX7E Datasheet Page 9W987D2HBJX7E Datasheet Page 10W987D2HBJX7E Datasheet Page 11W987D2HBJX7E Datasheet Page 12W987D2HBJX7E Datasheet Page 13W987D2HBJX7E Datasheet Page 14

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