Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
|
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA |
In Stock517 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SX |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz |
Primary Attributes: FPGA - 25K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 672-FBGA |
Supplier Device Package: 672-UBGA (23x23) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock462 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA |
In Stock717 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz |
Primary Attributes: FPGA - 85K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 672-FBGA |
Supplier Device Package: 672-UBGA (23x23) |
|
|
Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA |
In Stock522 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SX |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz |
Primary Attributes: FPGA - 40K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 672-FBGA |
Supplier Device Package: 672-UBGA (23x23) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 896FBGA |
In Stock472 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SX |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz |
Primary Attributes: FPGA - 85K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 925MHZ 672UBGA |
In Stock769 More on Order |
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Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 925MHz |
Primary Attributes: FPGA - 110K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 672-FBGA |
Supplier Device Package: 672-UBGA (23x23) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA |
In Stock314 More on Order |
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Manufacturer: Intel |
Series: Cyclone® V ST |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 800MHz |
Primary Attributes: FPGA - 85K Logic Elements |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA |
In Stock616 More on Order |
|
Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 625-BFBGA, FCBGA |
Supplier Device Package: 625-FCBGA (21x21) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256BGA |
In Stock701 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 64KB |
Peripherals: DDR |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 5K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 256-LFBGA |
Supplier Device Package: 256-VFPBGA (14x14) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256BGA |
In Stock534 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 64KB |
Peripherals: DDR |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 5K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 256-LFBGA |
Supplier Device Package: 256-VFPBGA (14x14) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA |
In Stock477 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 64KB |
Peripherals: DDR |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 5K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA |
In Stock736 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 10K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA |
In Stock429 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 10K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA |
In Stock580 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 25K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 325-TFBGA, CSPBGA |
Supplier Device Package: 325-CSPBGA (11x11) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA |
In Stock497 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 25K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 484UBGA |
In Stock570 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 800MHz |
Primary Attributes: FPGA - 25K Logic Elements |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-FBGA |
Supplier Device Package: 484-UBGA (19x19) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA |
In Stock627 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 325-TFBGA, CSPBGA |
Supplier Device Package: 325-CSPBGA (11x11) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock454 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock391 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock654 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock604 More on Order |
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Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA |
In Stock446 More on Order |
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Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MPU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 1.2MB |
Peripherals: DMA, WDT |
Connectivity: CANbus, I²C, SPI, UART/USART, USB |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 625-BFBGA, FCBGA |
Supplier Device Package: 625-FCBGA (21x21) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA |
In Stock594 More on Order |
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Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MPU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 1.2MB |
Peripherals: DMA, WDT |
Connectivity: CANbus, I²C, SPI, UART/USART, USB |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 625-BFBGA, FCBGA |
Supplier Device Package: 625-FCBGA (21x21) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA |
In Stock559 More on Order |
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Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MPU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 1.2MB |
Peripherals: DMA, WDT |
Connectivity: CANbus, I²C, SPI, UART/USART, USB |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 784-BFBGA, FCBGA |
Supplier Device Package: 784-FCBGA (23x23) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA |
In Stock390 More on Order |
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Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MPU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 1.8MB |
Peripherals: DMA, WDT |
Connectivity: CANbus, I²C, SPI, UART/USART, USB |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 625-BFBGA, FCBGA |
Supplier Device Package: 625-FCBGA (21x21) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA |
In Stock600 More on Order |
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Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MPU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 1.8MB |
Peripherals: DMA, WDT |
Connectivity: CANbus, I²C, SPI, UART/USART, USB |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 784-BFBGA, FCBGA |
Supplier Device Package: 784-FCBGA (23x23) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 896FBGA |
In Stock441 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz |
Primary Attributes: FPGA - 85K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA |
In Stock579 More on Order |
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Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 800MHz |
Primary Attributes: FPGA - 110K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 672-FBGA |
Supplier Device Package: 672-UBGA (23x23) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA |
In Stock279 More on Order |
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Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 800MHz |
Primary Attributes: FPGA - 110K Logic Elements |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
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Intel |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA |
In Stock570 More on Order |
|
Manufacturer: Intel |
Series: Cyclone® V SE |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 800MHz |
Primary Attributes: FPGA - 110K Logic Elements |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 672-FBGA |
Supplier Device Package: 672-UBGA (23x23) |