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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

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Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XCZU6EG-3FFVB1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock485 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU7EV-3FBVB900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock425 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU9EG-L2FFVB1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock532 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU11EG-2FFVC1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock474 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU11EG-L1FFVC1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock454 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU17EG-1FFVC1760E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA	In Stock236 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1760-BBGA, FCBGA	Supplier Device Package: 1760-FCBGA (42.5x42.5)
XCZU17EG-1FFVE1924E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA	In Stock382 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1924-BBGA, FCBGA	Supplier Device Package: 1924-FCBGA (45x45)
XCZU15EG-2FFVC900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock525 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU7EG-3FFVC1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock437 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 667MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU15EG-1FFVB1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock214 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU17EG-1FFVB1517I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock314 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU9EG-3FFVC900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock273 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU11EG-2FFVB1517I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock461 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU11EG-L2FFVB1517E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock542 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU7EG-3FFVF1517E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock543 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 667MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU11EG-2FFVF1517E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock223 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU11EG-L1FFVF1517I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock350 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU7EV-3FFVC1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock509 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU19EG-1FFVC1760E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA	In Stock403 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1760-BBGA, FCBGA	Supplier Device Package: 1760-FCBGA (42.5x42.5)
XCZU19EG-1FFVE1924E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA	In Stock509 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1924-BBGA, FCBGA	Supplier Device Package: 1924-FCBGA (45x45)
XCZU11EG-1FFVC1760I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA	In Stock466 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1760-BBGA, FCBGA	Supplier Device Package: 1760-FCBGA (42.5x42.5)
XCZU17EG-1FFVD1760E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA	In Stock439 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1760-BBGA, FCBGA	Supplier Device Package: 1760-FCBGA (42.5x42.5)
XCZU11EG-2FFVC1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock348 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU11EG-L2FFVC1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock256 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU7EV-3FFVF1517E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock576 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EV	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz, 1.5GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU19EG-1FFVB1517I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA	In Stock471 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1517-BBGA, FCBGA	Supplier Device Package: 1517-FCBGA (40x40)
XCZU15EG-2FFVB1156E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock296 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU15EG-L1FFVB1156I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA	In Stock427 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1156-BBGA, FCBGA	Supplier Device Package: 1156-FCBGA (35x35)
XCZU15EG-2FFVC900I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock470 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)
XCZU15EG-L2FFVC900E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 900FCBGA	In Stock331 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 900-BBGA, FCBGA	Supplier Device Package: 900-FCBGA (31x31)