Top

SoC (System On Chip)

Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Loading...
Reset
Show Filters
Reset Filters
Apply Filters
CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)
Records 2,134
Page 63/72
Image
Part Number
Manufacturer
Description
In Stock
Quantity
Series
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
A2F500M3G-FGG256I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 256FBGA

In Stock373

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
A2F500M3G-FG256I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 256FBGA

In Stock552

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
A2F500M3G-1FG256I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 256FBGA

In Stock429

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
A2F200M3F-1FG256I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 256FBGA

In Stock328

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
A2F500M3G-1CS288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock337

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-CS288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock431

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-CSG288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock495

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F500M3G-CSG288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock226

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F200M3F-CSG288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock407

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-1CS288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock425

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F200M3F-CS288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock524

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-1CS288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock662

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F200M3F-1CSG288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock585

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-1CSG288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock341

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-1CSG288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock562

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-CSG288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock520

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F200M3F-CS288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock435

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F500M3G-1CSG288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 100MHZ 288CSP

In Stock455

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F060M3E-CS288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock531

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F500M3G-CSG288
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock228

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
A2F200M3F-CSG288I
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 80MHZ 288CSP

In Stock167

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 288-TFBGA, CSPBGA
Supplier Device Package: 288-CSP (11x11)
M2S050T-FG896
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock452

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
M2S050T-FGG896ES
Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 896FBGA

In Stock522

More on Order

Manufacturer: Microsemi Corporation
Series: SmartFusion®2
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
XC7Z020-1CLG400CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

In Stock398

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)
XC7Z020-1CLG484CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 484BGA

In Stock551

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)
XC7Z020-2CLG400CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 766MHZ 400BGA

In Stock443

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 766MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)
XC7Z020-2CLG484CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 766MHZ 484BGA

In Stock530

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 766MHz
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)
XC7Z045-1FFG900CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

In Stock314

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
XC7Z045-1FBG676CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 676FCBGA

In Stock503

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
XC7Z045-2FFG900CES
Xilinx

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

In Stock306

More on Order

Manufacturer: Xilinx Inc.
Series: Zynq®-7000
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)