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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 20/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
M2S060T-1FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock199 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060T-FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock191 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060T-FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock230 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock162 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock247 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060T-1FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock419 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
XC7Z012S-2CLG485E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 766MHZ 485CSBGA	In Stock548 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 766MHz	Primary Attributes: Artix™-7 FPGA, 55K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 484-LFBGA, CSPBGA	Supplier Device Package: 485-CSBGA (19x19)
M2S090-1FCS325	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock449 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090-1FCSG325	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock304 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090-FCS325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock315 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090-FCSG325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock353 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S050T-1FG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock154 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050T-1FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock395 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050TS-1FG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock593 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050TS-1FGG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock231 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050TS-FG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock190 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050TS-FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock244 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S060T-1VF400I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock258 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
M2S060T-1VFG400I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock476 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
M2S060TS-1VF400	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock522 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
M2S060TS-1VFG400	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock452 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
M2S060TS-VF400I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock199 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
M2S060TS-VFG400I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock267 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
M2S050-1FG896	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock495 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050-1FGG896	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock408 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050-FG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock524 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050-FGG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock401 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S060-1FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock243 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060-1FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock481 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S050TS-1VF400I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock517 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)