SoC (System On Chip)

Manufacturer

Reset

Series

Reset

Architecture

Reset

Core Processor

Reset

Flash Size

Reset

RAM Size

Reset

Peripherals

Reset

Connectivity

Reset

Speed

Reset

Primary Attributes

Reset

Operating Temperature

Reset

Package / Case

Reset

Supplier Device Package

Reset

Show Filters

Reset Filters

Apply Filters

CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 22/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
M2S060T-1FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock414 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock229 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock460 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock367 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock619 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock454 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock405 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
XC7Z020-L1CLG400I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 400BGA	In Stock439 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Artix™-7 FPGA, 85K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 400-LFBGA, CSPBGA	Supplier Device Package: 400-CSPBGA (17x17)
M2S090-FG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock291 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090-FGG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock498 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S060TS-1FG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock507 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1FGG676I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock373 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S050T-1FG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock429 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050T-1FGG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock234 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050TS-1FG896	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock540 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050TS-1FGG896	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock276 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050TS-FG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock455 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S050TS-FGG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock456 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S090T-1FCS325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock446 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090T-1FCSG325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock626 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-1FCS325	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock585 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-1FCSG325	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock414 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-FCS325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock670 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S090TS-FCSG325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock258 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
XC7Z020-L1CLG484I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 484BGA	In Stock322 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Artix™-7 FPGA, 85K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-LFBGA, CSPBGA	Supplier Device Package: 484-CSPBGA (19x19)
M2S090-FG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock222 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S090-FGG676	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA	In Stock333 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 676-BGA	Supplier Device Package: 676-FBGA (27x27)
M2S060TS-1VFG400T2	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 400VFBGA	In Stock203 More on Order	Manufacturer: Microsemi Corporation	Series: Automotive, AEC-Q100, SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 125°C (TJ)	Package / Case: 400-LFBGA	Supplier Device Package: 400-VFBGA (17x17)
XC7Z015-L1CLG485I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 485CSBGA	In Stock361 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 667MHz	Primary Attributes: Artix™-7 FPGA, 74K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-LFBGA, CSPBGA	Supplier Device Package: 485-CSBGA (19x19)
M2S050TS-1FG896I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock227 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)