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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 28/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XCZU2CG-L2SFVA625E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock516 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
M2S150TS-1FCS536	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA	In Stock163 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 536-LFBGA, CSPBGA	Supplier Device Package: 536-CSPBGA (16x16)
M2S150TS-1FCSG536	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA	In Stock458 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 536-LFBGA, CSPBGA	Supplier Device Package: 536-CSPBGA (16x16)
M2S150TS-FCS536I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA	In Stock479 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 536-LFBGA, CSPBGA	Supplier Device Package: 536-CSPBGA (16x16)
M2S150TS-FCSG536I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA	In Stock595 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 536-LFBGA, CSPBGA	Supplier Device Package: 536-CSPBGA (16x16)
XCZU2CG-2SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock361 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU2CG-L2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock229 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XC7Z030-2FB484I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 484FCBGA	In Stock214 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BBGA, FCBGA	Supplier Device Package: 484-FCBGA (23x23)
XCZU2EG-2SFVA625E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock315 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XC7Z030-L2SBG485I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 485FCBGA	In Stock386 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-FBGA, FCBGA	Supplier Device Package: 485-FCBGA (19x19)
XAZU2EG-1SFVA625Q	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock206 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.2MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 125°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XCZU2EG-2SFVC784E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock261 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XAZU2EG-1SBVA484Q	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock518 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.2MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 125°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
M2S150TS-1FC1152I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA	In Stock595 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1152-BBGA, FCBGA	Supplier Device Package: 1152-FCBGA (35x35)
M2S150TS-1FCG1152I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA	In Stock244 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 1152-BBGA, FCBGA	Supplier Device Package: 1152-FCBGA (35x35)
XC7Z030-3FBG676E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 1GHZ 676FCBGA	In Stock304 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 1GHz	Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XC7Z030-L2FBG676I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA	In Stock462 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XAZU2EG-1SFVC784Q	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock434 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.2MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 125°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XCZU3EG-1SBVA484E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock490 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
M2S150TS-1FCS536I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA	In Stock468 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 536-LFBGA, CSPBGA	Supplier Device Package: 536-CSPBGA (16x16)
M2S150TS-1FCSG536I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA	In Stock554 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 536-LFBGA, CSPBGA	Supplier Device Package: 536-CSPBGA (16x16)
M2S090T-1FG484M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock562 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S090T-1FGG484M	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock289 More on Order	Manufacturer: Microsemi Corporation	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -55°C ~ 125°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
XC7Z030-2SB485I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 485FCBGA	In Stock383 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-FBGA, FCBGA	Supplier Device Package: 485-FCBGA (19x19)
XCZU2EG-2SBVA484I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock645 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
XCZU2EG-L2SBVA484E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock486 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
XC7Z030-2FFG676E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 676FCBGA	In Stock284 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq®-7000	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 676-BBGA, FCBGA	Supplier Device Package: 676-FCBGA (27x27)
XCZU3EG-1SFVA625E	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock175 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: 0°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XCZU3CG-1SBVA484I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA	In Stock400 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC CG	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BFBGA, FCBGA	Supplier Device Package: 484-FCBGA (19x19)
XCZU2EG-2SFVA625I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock335 More on Order	Manufacturer: Xilinx Inc.	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 533MHz, 600MHz, 1.3GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)