Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
|
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock221 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -55°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock398 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -55°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA |
In Stock397 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 1152-BBGA, FCBGA |
Supplier Device Package: 1152-FCBGA (35x35) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA |
In Stock543 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 1152-BBGA, FCBGA |
Supplier Device Package: 1152-FCBGA (35x35) |
|
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 484FCBGA |
In Stock345 More on Order |
|
Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 484-BFBGA, FCBGA |
Supplier Device Package: 484-FCBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock263 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 676FBGA |
In Stock261 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 676-BGA |
Supplier Device Package: 676-FBGA (27x27) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA |
In Stock252 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 536-LFBGA, CSPBGA |
Supplier Device Package: 536-CSPBGA (16x16) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA |
In Stock335 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 536-LFBGA, CSPBGA |
Supplier Device Package: 536-CSPBGA (16x16) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock515 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock482 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock424 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -55°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock194 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: -55°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA |
In Stock497 More on Order |
|
Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 625-BFBGA, FCBGA |
Supplier Device Package: 625-FCBGA (21x21) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock463 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock210 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock446 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock501 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -55°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock430 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 60K Logic Modules |
Operating Temperature: -55°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA |
In Stock384 More on Order |
|
Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 784-BFBGA, FCBGA |
Supplier Device Package: 784-FCBGA (23x23) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock258 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: Automotive, AEC-Q100, SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 90K Logic Modules |
Operating Temperature: -40°C ~ 125°C (TJ) |
Package / Case: 484-BGA |
Supplier Device Package: 484-FPBGA (23x23) |
|
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA |
In Stock297 More on Order |
|
Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC CG |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 625-BFBGA, FCBGA |
Supplier Device Package: 625-FCBGA (21x21) |
|
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA |
In Stock345 More on Order |
|
Manufacturer: Xilinx Inc. |
Series: Zynq® UltraScale+™ MPSoC CG |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 784-BFBGA, FCBGA |
Supplier Device Package: 784-FCBGA (23x23) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA |
In Stock239 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 536-LFBGA, CSPBGA |
Supplier Device Package: 536-CSPBGA (16x16) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 536BGA |
In Stock417 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 536-LFBGA, CSPBGA |
Supplier Device Package: 536-CSPBGA (16x16) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock476 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock610 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock355 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA |
In Stock533 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 484-BFBGA |
Supplier Device Package: 484-FBGA (19x19) |
|
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Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 1152BGA |
In Stock281 More on Order |
|
Manufacturer: Microsemi Corporation |
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 150K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 1152-BBGA, FCBGA |
Supplier Device Package: 1152-FCBGA (35x35) |